PhoneBunch

This is how Sony plans to combat Snapdragon 810 heating on the Xperia Z5 Premium

Snapdragon 810 has a penchant for overheating, that much is certain. So, when Sony decided to pack it in a metal and glass body with a 4K display up-front on the Xperia Z5 Premium, eyebrows were raised at the rationale. But the thing is, there's no alternative to the Snapdragon 810 if Sony wanted to push so many pixels.

Here's the solution then. Dual heat-sink pipes, with a lot and I mean a lot of thermal paste for better heat conduction. The heat-sink pipes are placed probably where the CPU is going to be. The metal frame will bear most of the brunt of heat dissipation, leaving the display and back more comfortable to hold.

Screen Size 5.5 inches (2160 x 3840 pixels, 806 ppi)
Camera Back: 23 MP, 2160p@30fps; Front: 5.1 MP
Processor Qualcomm MSM8994 Snapdragon 810
Memory 32 GB, 3 GB RAM
OS Android OS, v5.1.1 (Lollipop)
Dimension & Weight 154.4 x 75.8 x 7.8 mm, 180 g
Connectivity LTE
Battery 3430 mAh

Although most reviewers who used the phone at IFA 2015 said that it didn't heat-up, real world tests might tell a different story.

Via: G For Games

Source: Weibo (in Chinese)

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