MediaTek Dimensity 9300 launched with Up to 40% faster multi-core CPU, 12-Core Immortalis-G720 GPU; First Power on Vivo X100
MediaTek recently unveiled the Dimensity 9300, their latest top-of-the-line System on a Chip (SoC), succeeding the Dimensity 9200 / 9200+. This new release is built on the third-generation 4nm process technology from TSMC, incorporating a second-generation thermally optimized IC design and package.
Regarding its CPU and GPU specifications, the Dimensity 9300 features a configuration that includes one ARM Cortex-X4 performance core clocked at 3.25GHz, along with three additional performance cores, ARM Cortex-X4, running at a slightly lower speed of 2.85GHz. Additionally, it incorporates four Cortex-A720 efficiency cores clocked at 2.0GHz.
According to the company, this configuration leads to a 15% enhancement in single-core CPU performance and a 40% boost in multi-core performance when compared to the previous Dimensity 9200. Moreover, the CPU's peak performance power consumption is reduced by 33% compared to its predecessor.
The SoC also introduces the new Immortalis-G720 GPU, offering a notable 46% improvement in hardware ray tracing performance compared to the previous generation. It boasts a hardware-based ray tracing engine and variable rate rendering technology that purportedly provides 46% more power than the previous model. MediaTek claims that this GPU achieves a 40% reduction in power consumption while maintaining the same level of performance as the preceding chipset.
During the announcement event, MediaTek highlighted its partnerships with several companies to optimize ray tracing in games. As of now, more than 50 games of various genres have joined the Dimensity ray tracing ecosystem, incorporating the three leading engines of Unity, Unreal, and Messiah, providing gamers with a highly immersive visual experience.
Additionally, MediaTek emphasized its commitment to further developing the Dimensity platform's developer ecosystem, fostering deep collaborations with numerous game developers to establish a robust Dimensity game ecosystem.
APU -
MediaTek said that the APU 790 delivers twice the AI processing power in both integer and floating-point operations, along with a 45% reduction in power consumption. Through the implementation of the Transformer model for operator acceleration, the APU 790 achieves a processing speed that is eight times faster than the previous generation. According to the company, it can generate images within one second using Stable Diffusion.
The APU 790 is equipped with NeuroPilot Fusion support, enabling continuous LoRA low-rank adaptation. Moreover, it can handle large language models featuring 1B, 7B, and 13B parameters, with the potential for scalability up to 33B.
AI Ecosystem -
Within the comprehensive AI ecosystem developed by MediaTek, the Dimensity 9300 is designed to support cutting-edge mainstream large language models, including Meta Llama 2, Baichuan 2, Baidu AI LLM, and more.
Utilizing the robust on-device AI capability of the Dimensity 9300, the display system efficiently detects primary objects and background images in real time. Teamed with the MiraVision Picture Quality (PQ) engine, it dynamically adjusts the contrast, sharpness, and color of primary objects, elevating the overall image quality with enhanced depth, and offering a lifelike video experience comparable to today's top-of-the-line DTVs, as per MediaTek.
Display and ISP -
The Dimensity 9300 is capable of supporting always-on HDR up to 4K resolution at 60 frames per second (fps). Moreover, it facilitates a cinematic mode at 4K and 30 fps, incorporating real-time bokeh tracking for professional-grade bokeh enhancements. It also provides 4K AI Noise Reduction (AI-NR) and AI processing for RAW photos and videos.
The Imagiq 990 introduces a novel bidirectional direct coupling between the Image Signal Processor (ISP) and the APU, ensuring a zero-latency video preview experience. The 18-bit RAW ISP design includes an AI Semantic Analysis Video Engine equipped with 16 categories of scene segmentation adjustment, enhancing the visual appeal of cinematic video capture.
Furthermore, the Dimensity 9300 is set to support the upcoming Ultra HDR format within Android 14, catering to the requirements of the next generation of smartphones. It incorporates ambient light adaptive HDR recovery technology.
In terms of connectivity, the Dimensity 9300 is equipped with Wi-Fi 7 support and integrates MediaTek Xtra Range Technology, enabling improved long-range connectivity. According to the company, the MediaTek Multi-Link Hotspot technology enhances smartphone tethering speeds by up to three times compared to competitive solutions.
MediaTek Dimensity 9300 Specifications -
CPU | 1 x ARM Cortex-X4 cores up to 3.25GHz + 3 x ARM Cortex-X4 cores up to 2.85GHz + 4 x Cortex-A720 cores at up to 2.0GHz, 18MB L3 + SLC cache: 29% larger than previous generation |
Process | TSMC’s third-generation 4nm process |
RAM/Storage | Supports LPDDR5T 9600Mbps memory up to 9600Mbps,UFS 4 + MCQ |
GPU | Arm Immortalis-G720 MC12 GPU, 2X MSAA support, 2X Pixel blend throughput, 2X Texture throughput |
Sensors | Secure Processor, HWRoT, Arm Memory Tagging Extension (MTE) Technology, CC EAL4+ Capable, FIPS 140-3, China DRM |
Camera | Up to 320MP camera, Imagiq 990 |
Display | WQHD at 180Hz and 4K up to 120Hz |
Network | Sub-6GHz (FR1), mmWave (FR2), 2G-5G multi-mode, 5G-CA, 4G-CA, 5G FDD / TDD, 4G FDD / TDD, TD-SCDMA, WCDMA, EDGE, GSM |
Multi-SIM | 5G/4G Dual SIM Dual Active, SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR FR1 TDD+FDD, DSS, FR1 DL 4CC up to 300 MHz 4×4 MIMO, FR2 DL 4CC up to 400MHz, 256QAM FR1 UL 2CC 2×2 MIMO, 256QAM NR UL 2CC, R16 UL Enhancement, 256QAM VoNR / EPS fallback |
Connectivity |
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Availability -
The initial smartphones incorporating the Dimensity 9300 chipset are expected to be released in the market before the conclusion of 2023. Notably, Vivo has officially announced that the X100, set to debut on November 13th in China, will be the first device to integrate this chipset.
OPPO has officially announced its intention to incorporate the Dimensity 9300 System-on-Chip (SoC) in the upcoming Find X series smartphone, likely to be designated as the Find X7 series.