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MediaTek Dimensity 7100 6nm SoC launched with Upgraded GPU, Better Power Efficiency

MediaTek has quietly unveiled its newest 5G chipset designed for the next generation of mid-range smartphones, the Dimensity 7100 SoC. The processor is manufactured using TSMC’s 6nm process and delivers notable improvements in power efficiency over its predecessor.

According to MediaTek, the Dimensity 7100 offers up to 5% better power efficiency in applications, up to 23% improved modem efficiency, and up to 16% lower power consumption during multimedia playback.

The company also highlights a GPU upgrade that boosts gaming performance by up to 8%, enabling smoother visuals and longer gaming sessions. In addition, the chipset introduces an enhanced power management system with integrated 45W fast charging, support for UFCS universal charging standards, and ultra-low voltage operation, which can extend battery life by up to 7% compared to standard voltage designs.

MediaTek Dimensity 7100 Specifications -

CPU Octa-core: 4 × Arm Cortex-A78 @ 2.4GHz, 4 × Arm Cortex-A55 @ 2.0GHz
GPU Arm Mali-G610 MC2
Process 6nm TSMC
Memory LPDDR5 @ 5500 Mbps, LPDDR4x @ 4266 Mbps
Storage UFS 3.1
Display Resolution Up to 1200 × 2600
Cellular 2G / 3G / 4G / 5G Multi-Mode, EDGE, GSM, TD-SCDMA, WCDMA, 4G FDD / TDD, 5G FDD / TDD, 4G Carrier Aggregation (CA), 5G Carrier Aggregation (CA)
Cellular Features 3GPP R16, Global SA & NSA; SA Option 2, NSA Option 3 / 3a / 3x, NR TDD & FDD Bands, DSS, NR DL 2CC (140 MHz), 256QAM NR UL 1CC, 256QAM VoNR, Dual VoNR, Dual 5G SIM, EPS Fallback
Camera Up to 200MP camera, advanced HDR video with DCG/DAG technology
Connectivity 1T1R Wi-Fi Antenna, Wi-Fi 6 (a/b/g/n/ac/ax), Bluetooth 5.4, Bluetooth Long Range, BT/Wi-Fi Hyper Coexistence

Availability -

MediaTek has yet to announce official availability details for the Dimensity 7100 chipset. However, rumours suggest that the Infinix Note Edge, expected to launch later this January, could be the first smartphone to feature the new processor.

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