MediaTek Dimensity 8400 Detailed Specs Surfaced Online; Expected to launch on December 23

MediaTek is preparing to launch its upcoming Dimensity 8400 chipset, the latest addition to the 8000 series, later this month. Detailed specifications have been leaked by Digital Chat Station, providing a glimpse into its performance and features.

The octa-core processor will continue using TSMC’s 4nm process, as seen in the Dimensity 8300, but introduces a new architecture with all Cortex-A725 cores, replacing the previous A5xx cores. The configuration includes:

• 1 x 3.25GHz Cortex-A725 core
• 3 x 3.0GHz Cortex-A725 cores
• 4 x 2.1GHz Cortex-A725 cores
• 1.3GHz Immortalis G720 MC7 GPU

The chipset reportedly achieves an impressive 1.8 million points on AnTuTu, surpassing the 1.52 million points scored by the Redmi K70E in China and 1.48 million points by the global POCO X6 Pro, both powered by the Dimensity 8300-Ultra SoC.

The Dimensity 8400 is expected to power the upcoming Redmi Turbo 4, slated for release early next year. This model will replace the Snapdragon 8s Gen 3 found in its predecessor, the Redmi Turbo 3. In global markets, the Redmi Turbo 3 was rebranded as the POCO F6, which scored 1.52 million points on AnTuTu.

According to previous leaks, the Redmi Turbo 4 will feature a 1.5K LTPS flat display with ultra-narrow bezels, a glass back, a plastic frame, an optical fingerprint scanner, a 50MP rear camera, and a 6500mAh battery. The MediaTek Dimensity 8400 is tentatively scheduled for an official announcement on December 23rd. Further confirmation is expected in the coming days.

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