RedMagic 12 Pro+ to be launched on October 15 with RGB Water-Cooled System

RedMagic has released a series of teasers for its upcoming flagship smartphone, the RedMagic 12 Pro+, ahead of its official launch on October 15 in China. According to announcements on the company’s official Weibo account and statements from General Manager Jiang Chao, the device will feature what the brand claims is the smartphone industry’s first RGB water-cooled thermal management system.

Dual-Ring Liquid Cooling System

The RedMagic 12 Pro+ introduces a redesigned dual-ring liquid-cooling architecture that increases coolant channel volume and surface area compared to its predecessor, the RedMagic 11 Pro+. An integrated micro-pump circulates the coolant through two dedicated paths:

• Upper cooling channel: Designed to dissipate heat generated by the System-on-a-Chip (SoC).
• Lower cooling channel: Dedicated to managing heat from the battery module.

Both channels merge before reaching the airflow chamber, where an integrated cooling fan expels the accumulated heat. This combination of liquid circulation and forced-air cooling enables a hybrid thermal management system.

To accommodate the expanded cooling channels and increased flow resistance, Red Magic has upgraded the pump to a dual-crystal-driven micro-pump. The new unit delivers an operating output pressure of 130 kPa, compared to 100 kPa in the previous generation, helping increase coolant flow velocity throughout the system.

The cooling loop uses a non-conductive, electrically insulating fluorinated fluid, similar to the type used in AI server racks.

Red Magic has also incorporated a custom light-guide structure above the airflow duct. This design allows RGB lighting to illuminate the coolant circulation path, visually highlighting the operation of the liquid-cooling system.

Design Refinements and Hardware Specifications

Alongside the cooling upgrades, RedMagic has revealed several physical design improvements for the upcoming flagship.

• Thinner and lighter design: The chassis has been redesigned to reduce thickness and weight, with more rounded corners intended to improve in-hand comfort.
• Narrower display bezels: The front bezels have been reduced from 1.25 mm on the previous generation to just 0.96 mm, offering a more immersive viewing experience.
• Processor: The smartphone will be powered by Qualcomm’s Snapdragon 8 Elite Extreme Gen 6 platform.

RedMagic is expected to announce the complete specifications, memory and storage configurations, pricing, and availability details at its official product launch event on October 15.